Wire Bonder Equipment Pros and Cons
Ball bonder vendor
- Kulicke & Soffa (K&S) , major market share
- website: https://www.kns.com/Products/Equipment/Ball-Bonder
- model: Maxium ultra, Elite, Connx, Iconn, Connx Plus, Iconn Plus, ProCu series for copper wire, LED series for LED
- personal overall point of view:
- Pro:
- good at thin wire, fine pitch
- good at looping
- performance is stable
- output calibration OBPF is quite easy to carry out
- Con:
- Gas cover kit (GCK) is assembled piece by piece, which is not easy for preventing oxygen going inside.
- nozzle is not good at deep downset product.
- heavy wire solution is not good.
- ASM Pacific Technology (ASM), minor market share
- website: http://www1.asmpacific.com/en/products?equipment=4
- model: AB339, Eagle 60, Eagle 60AP, iHawk Xtreme, iHawk Xpress, Eagle Xtreme, iHawk Xpress, Eagle Xtreme, Eagle Xpress, and Gocu series for copper wire, LED series for LED product, and lastest platform is called "Aero", integrated with statistical function inside and new X-direction vibration for easy Aluminum splash control.
- personal overall point of view:
- Pro:
- integrated heat tunnel, good at preventing bare copper leadframe from oxidation.
- nozzle is good at preventing oxidation for deep downset product.
- good at heavy wire.
- Con:
- User interface: too many dialogue to confirm
- too many software version, lots of bugs
- repeatability is not good. could be sensitive to raw material precision.
- nozzle is complex (not easy for threading) and expensive.
- output calibration TVC is not easy to do.
- Others, like Shinkawa
- from Japan, mostly used by Japanese company.
Wedge bonder for Alumium, copper wire
OE (now is K&S), F&K
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